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MBRF20100CT
Preferred Device
SWITCHMODEt Schottky Power Rectifier
The SWITCHMODE Power Rectifier employs the Schottky Barrier principle in a large area metal- to- silicon power diode. State-of-the-art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for use as rectifiers in very low-voltage, high-frequency switching power supplies, free wheeling diodes and polarity protection diodes.
Features http://onsemi.com
* * * * * * * * * *
Highly Stable Oxide Passivated Junction Very Low Forward Voltage Drop Matched Dual Die Construction High Junction Temperature Capability High dv/dt Capability Excellent Ability to Withstand Reverse Avalanche Energy Transients Guardring for Stress Protection Epoxy Meets UL 94 V-0 @ 0.125 in Electrically Isolated. No Isolation Hardware Required. Pb-Free Package is Available*
SCHOTTKY BARRIER RECTIFIER 20 AMPERES, 100 VOLTS
1 2 3
ISOLATED TO-220 CASE 221D STYLE 3 1 2
Mechanical Characteristics:
* Case: Epoxy, Molded * Weight: 1.9 Grams (Approximately) * Finish: All External Surfaces Corrosion Resistant and Terminal *
Leads are Readily Solderable Lead Temperature for Soldering Purposes: 260C Max. for 10 Seconds
3
MARKING DIAGRAM
AYWW B20100G AKA
A Y WW B20100 G AKA
= Assembly Location = Year = Work Week = Device Code = Pb-Free Package = Polarity Designator
ORDERING INFORMATION
Device MBRF20100CT MBRF20100CTG *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
(c) Semiconductor Components Industries, LLC, 2007
Package TO-220 TO-220 (Pb-Free)
Shipping 50 Units/Rail 50 Units/Rail
Preferred devices are recommended choices for future use and best overall value.
1
June, 2007 - Rev. 7
Publication Order Number: MBRF20100CT/D
MBRF20100CT
MAXIMUM RATINGS (Per Leg)
Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (Rated VR), TC = 133C Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz), TC = 133C Non-repetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) Peak Repetitive Reverse Surge Current (2.0 ms, 1.0 kHz) Operating Junction and Storage Temperature Range (Note 1) Voltage Rate of Change (Rated VR) Total Device IFRM IFSM IRRM TJ, Tstg dv/dt Symbol VRRM VRWM VR IF(AV) Value 100 Unit V
10 20 20 150 0.5 - 65 to +175 10000
A A A A C V/ms
RMS Isolation Voltage (t = 0.3 second, R.H. 30%, TA = 25C) (Note 2) Per Figure 3 Viso1 4500 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS (Per Leg)
Rating Maximum Thermal Resistance, Junction to Case Lead Temperature for Soldering Purposes: 1/8 from Case for 5 Seconds Symbol RqJC TL Value 3.5 260 Unit C/W C
ELECTRICAL CHARACTERISTICS (Per Leg)
Characteristic Maximum Instantaneous Forward Voltage (Note 3) (iF = 10 Amp, TC = 25C) (iF = 10 Amp, TC = 125C) (iF = 20 Amp, TC = 25C) (iF = 20 Amp, TC = 125C) Maximum Instantaneous Reverse Current (Note 3) (Rated DC Voltage, TC = 25C) (Rated DC Voltage, TC = 125C) Symbol vF 0.85 0.75 0.95 0.85 iR 0.15 150 mA Max Unit V
1. The heat generated must be less than the thermal conductivity from Junction-to-Ambient: dPD/dTJ < 1/RqJA. 2. Proper strike and creepage distance must be provided. 3. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%.
i F, INSTANTANEOUS FORWARD CURRENT (AMPS)
50 I R, REVERSE CURRENT (mA) 20 10 100C 5.0 3.0 TJ = 25C 150C 10 TJ = 125C TJ = 100C 1.0 TJ = 150C
0.1
1.0 0.5 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 vF, INSTANTANEOUS VOLTAGE (VOLTS) 0.9 1.0
0.01 0 20
TJ = 25C 40 60 80 100 VR, REVERSE VOLTAGE (VOLTS) 120
Figure 1. Typical Forward Voltage Per Diode
Figure 2. Typical Reverse Current Per Diode
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MBRF20100CT
TEST CONDITIONS FOR ISOLATION TESTS*
FULLY ISOLATED PACKAGE LEADS
HEATSINK
0.110, MIN
Figure 3. Mounting Position for Isolation Test Number 1 *Measurement made between leads and heatsink with all leads shorted together.
MOUNTING INFORMATION
CLIP
HEATSINK
Clip-Mounted Figure 4. Typical Mounting Technique
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MBRF20100CT
PACKAGE DIMENSIONS
TO-220 FULLPAK CASE 221D-03 ISSUE J
-TF Q A
123
SEATING PLANE
-B-
C S U
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH 3. 221D-01 THRU 221D-02 OBSOLETE, NEW STANDARD 221D-03. INCHES MIN MAX 0.617 0.635 0.392 0.419 0.177 0.193 0.024 0.039 0.116 0.129 0.100 BSC 0.118 0.135 0.018 0.025 0.503 0.541 0.048 0.058 0.200 BSC 0.122 0.138 0.099 0.117 0.092 0.113 0.239 0.271 MILLIMETERS MIN MAX 15.67 16.12 9.96 10.63 4.50 4.90 0.60 1.00 2.95 3.28 2.54 BSC 3.00 3.43 0.45 0.63 12.78 13.73 1.23 1.47 5.08 BSC 3.10 3.50 2.51 2.96 2.34 2.87 6.06 6.88
H K -Y-
G N L D
3 PL M
J R
DIM A B C D F G H J K L N Q R S U
0.25 (0.010)
B
M
Y
STYLE 3: PIN 1. ANODE 2. CATHODE 3. ANODE
SWITCHMODE is a trademark of Semiconductor Components Industries, LLC.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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MBRF20100CT/D

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